Product features

•Newly developed “Gale” cooling shell with aluminum armor and thermal conductive adhesive material to speed up heat dissipation, and two symmetric wings to maintain uniform heat dissipation;
•8-layer PCB with frequency from 2666 to 3200MHz to provide more stable and more efficient signal transmission;
•Strictly selected DRAM chips with high stability and reliability;
•Compatibility with mainstream platforms, high stability and tolerance.