Moonlight
Product features
•Selected premium DRAM chips
•All-aluminum integrated design, high heat dissipation coefficient 138W/(m.c) material to ensure rapid heat dissipation, to maintain long-term stable operation of the product;
•Multi-layer PCB and chemical deposition technology greatly enhance the signal anti-interference ability, and ensure fast and stable transmission of signals;
•PMU integrated power supply design ensures flexible voltage control;
•It supports intel XMP3.0 and EXPO technology so as to one-click overclocking up to 6400MHZ.
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