Product features

•Carefully selected premium DRAM chips
•All-aluminum integrated design with a high heat dissipation coefficient of 138W/(m.c) ensures rapid heat dissipation, maintaining long-term and stable operations;
•Multi-layer PCB and chemical deposition technology greatly enhance the signal anti-interference capability, ensuring fast and stable transmission of signals;
•PMU integrated power supply design ensures flexible voltage control;
•The product is made of lead-free raw materials,have undergone high-temperature aging tests to ensure they are environmentally friendly and reliable.
•Supports intel XMP3.0 and EXPO technology, one-click overclocking up to 6000/6400MHZ.