Product features

• Supports AMD E.X.PO. and XMP 3.0 dual platform overclocking
• The ten layer PCB has more ample wiring space, which can effectively reduce line interference and make high-frequency signal transmission purer and more stable. With excellent electrical performance, it can achieve more precise impedance control, significantly reduce signal attenuation, and significantly improve data transmission efficiency, providing strong support for game loading and large-scale software operation.
• ECC error correction: Introducing error correction code (ECC) technology can improve data accuracy, reduce system crash risk, and ensure that games will not encounter problems due to memory data errors during long-term operation.
•High quality materials and design: using high-quality memory particles, with good physical fitness and great overclocking potential.