• 数据加速模式：大幅提升产品的读写性能，既能优化用户体验，又能提高生产效率。
• 动/静态磨损均衡算法：智能优化数据分布，延长闪存使用寿命。
• 主动读干扰替换技术：提前发现并规避数据干扰，为产品长期稳定使用保驾护航。
• 增强的ECC纠错：增强型数据纠错能力，比普通数据纠错算法提高至少30%纠错能力。
• 坏块生命周期管理：智能管理闪存坏块，延长闪存使用寿命。
• 无预期掉电保护：超过10万次的异常掉电承受能力，保护用户数据不丢失。
| 产品名称 | 产品型号 | 容量 | 协议标准 | NAND | Package封装 | Dimensions尺寸 | 工作温度 | 储存温度 |
| Kimtigo eMMC 5.1 | KM110SA2008GxA-DDD00WT | 8GB | eMMC 5.1 | 2D MLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| KM1SA3016G-A00W | 16GB | eMMC 5.1 | 2D MLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| KM210LM0032GxA-AAA00WT | 32GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| KM110SA1032GxA-AAA00WT | 32GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| KM310MA4032GxA-AAA00WT | 32GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| KM310MY1032GxA-AAA00WT | 32GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| KM3MA5032G-A00W | 32GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| KM3MA6064G-A00W | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| KM110SA1064GxA-AAA00WT | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| KM210LM0064GxA-AAA00WT | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| KM310MY1064GxA-AAA00WT | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| KM210LM0128GxA-AAA00WT | 128GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| KM3MA6128G-A00W | 128GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
